OTD ACADEMY
Sign in / Sign up
Library

LIBRARYSoldering and assembly basics.

A designed board is bare copper until parts are on it. Hand-soldering with an iron suits through-hole and larger SMD; reflow with paste and heat suits dense SMD. With the reflow profile.

A finished board is bare copper until the parts are on it. Assembly is either hand-soldering with an iron and solder, which is fine for through-hole and larger surface-mount parts, or reflow, where solder paste and heat melt every joint at once for dense boards. Know which your board needs before you order the parts.

Through-hole and surface-mount assembly

Through-hole parts drop into plated holes and solder on the far side; they are forgiving and strong, good for connectors and anything hand-built. Surface-mount parts sit on top of pads and range from easy 0805 chips down to fine-pitch packages that fight a hand iron. The part sizes on your board decide how you will assemble it.

Hand-soldering

Hand-soldering needs a temperature-controlled iron, solder, and flux, plus solder wick to undo mistakes. You heat the pad and the pin together, feed solder into the joint, and let it flow into a shiny fillet. Flux is what makes it easy: it cleans the metal so solder wets instead of balling up. Larger surface-mount parts hand-solder fine with a fine tip and patience.

Reflow soldering

For dense surface-mount boards, reflow does every joint at once. You apply solder paste (a mix of tiny solder balls and flux) to the pads, usually through a stencil, place the parts on the wet paste, and heat the whole board on a hotplate or in a reflow oven. The paste melts and pulls each part into place by surface tension, which is why reflow is the way to assemble crowded boards.

The heat follows a profile with four stages: a preheat ramp, a soak that evens the temperature and activates the flux, a reflow spike above the solder's melting point, and a controlled cool-down. Common lead-free paste (the SAC305 alloy) melts around 217 to 219 C and is taken to a peak near 245 to 255 C, held only briefly (CompuPhase). The paste datasheet gives the exact profile to follow.

A reflow temperature-versus-time curve with its four stages labelled: preheat ramp, soak, reflow spike above the melting point, and cool-down.
The reflow profile: preheat, soak, a spike above the solder's melting point, then a controlled cool-down.

Common defects

A few faults show up again and again. A solder bridge is stray solder shorting two pins, cleared with wick and flux. Tombstoning is a small two-pad part standing up on one end because one side reflowed first. A cold joint is dull and grainy from too little heat and can fail intermittently. Learn to spot these under a loupe and most assembly problems are quick fixes.

Deep dive· Why lead-free runs hotter

Older tin-lead solder melts near 183 C at its eutectic point; the lead-free SAC305 alloy melts around 217 C, over thirty degrees higher (CompuPhase). That higher melting point is why lead-free reflow needs a hotter peak and a tighter profile, and why the parts and the board have to tolerate more heat. It is also why the soak stage matters more for lead-free: the narrower window between melting solder and damaging parts leaves less room for an uneven board.

Checkpoint

Quick check

What is reflow soldering best suited for?
What is flux for when hand-soldering?
A part standing up on one end after reflow is called what?
0 / 3 correct

One Thousand Drones engineering team · verified 2026-07